2018版半導体デバイスシミュレータのバージョンアップ (2019/1/22

 

日本地区における保守中のユーザ様に対しまして、 2018版半導体デバイスシミュレータのバージョンアップを発送いたしました。

2018版の変更点について(英文)

·         Full-3D VCSEL vectorial optical model based on novel FDFD method.

·         Full-3D vectorial wave optical model based on novel FDFD method, opening new possibilities in modeling of silicon photonic waveguide devices.

·         New 3D mesh system with new 3D GUI.

·         UCB SPICE code imported into Crosslight software as a subset of minispice module. Both circuit-only and mixed-mode TCAD simulation can be performed and 2nd-order of time-stepping from
UCB SPICE can be used in mix-mode TCAD.

·         Floating contact with zero-sum current condition implemented in basic drift-diffusion solver.

·         Two-photon absorption model implemented for material optical gain model.

·         Bug fixes and model upgrade in various modules.

This version will be released later this year, after final testing has been completed. Customers with an up-to-date maintenance contract can contact their local sales representatives if they wish to try these new features right away.